CMP contract processing service - List of Manufacturers, Suppliers, Companies and Products

Pre-joining CMP contract processing services [Comprehensive catalog available]

Surface roughness precision Ra 0.1~0.3 nm! Achieving smooth mirror surfaces of polycrystalline materials with our proprietary CMP slurry and polishing pads!

This catalog is a comprehensive catalog of D-process, which conducts CMP and wafer direct bonding prototyping and mass production, along with the transfer of associated processes. It provides detailed information on contract processing for CMP, wafer bonding, seed layer formation, and plating, among others. [Contents (excerpt)] ■ Contract processing for CMP ■ Contract processing for wafer bonding ■ Contract processing for seed layer formation and plating ■ Other contract processing for processes ■ Back grinding (thinning) / Lapping / Diamond polishing ■ Edge treatment / Dicing *For more details, please refer to the PDF document or feel free to contact us.

• Company：D-process
• Price：Other

• Processing Contract